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  1. Master Thesis or Internship Quality "Rheological investigation of polymers for PCBs"

    AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    am 4.10.2019

    Your responsibilities: Using AT&S R&D grade air-bearing digital Rheometer to investigate the curing processes of resins, which includes: Measuring viscosity curves during the curing process, Determination of gel point and process...

  2. Master Thesis or Internship Quality "PCB integrated magnetic components for power electronic applications"

    AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    am 30.9.2019

    Your responsibilities: Developing one of the following applications to production readiness should be the main task of the thesis: Inductor for non-isolated DC/DC converter, Transformer for isolated DC/DC converter, These steps...

  3. Master Thesis or Internship Quality "Development of an ABAQUS Modelling Plugin for Fast Model creation"

    AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    am 30.9.2019

    Your responsibilities: Development of a python based Abaqus plugin supporting the AT&S PCB modeling procedure, Implementing the current modelling workflow into Abaqus finite element software environment, Generation of a Graphical...

  4. Master Thesis or Internship R&D "Influence of viscoelastic material models on finite element analysis of PCBs under cyclic temperature loads"

    AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    am 27.9.2019

    Your responsibilities: Quantitative assessment of visco-elastic time dependent material behavior in material models for thermoset, epoxy based FR4 laminates. Setup linear elastic and viscoelastic material models for epoxy based...

  5. Master Thesis or Internship Quality "Embedded Die Packaging - Characterization of inner layers` z-interfaces"

    AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    am 24.9.2019

    Your responsibilities: Quantitative testing of interfacial strength between component and PCB (e.g. adhesion evaluation between the surface and PCB materials…) Identification of the interfacial failure modes and mechanisms...

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