Einzelprozessentwickler/in Preassembly

Infineon Technologies Austria AG
  • Villach
  • Vollzeit
  • Berufserfahrung
  • 14.9.2017

Unit Process Development Expert Preassembly (f/m)

You will be part of a team responsible for the development of innovative, stable and cost-efficient wafer separation processes and will work in close collaboration with colleagues of technology development worldwide.

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Location: Villach
Job ID: 18764
Start date: immediately

Type of employment: Full time
Length of contract: Permanent

Job description

In your new role you will be responsible for:

  • new product preassembly process development and mature handover to production (processes: laser separation, mechanical dicing, vacuum mounting)
  • Optimization and harmonization to increase quality of silicon wafers with metallization and/or process cost
  • Handling of internal complaints regarding diced Wafers of the assembly and packaging experts
  • governing preassembly machine specification (e.g. Disco, Accretech, Lintec), creation of purchase specification and final acceptance tests of first-of-its-kind-tools
  • Selection and interpretation of physical and chemical analysis methods (e.g. optical microscopy, 3PBT, etc)
  • Support of technology project leaders, program manager and unit process engineers with qualification and documentation of technical results
  • Support and maintain active roles in KEC (Knowledge Exchange Community) globally
  • Mentoring new engineers on the technical skill and experience development

Your profile

You are able to quickly establish successful cooperations and gain new insights by questioning existing assumptions. You recognize and seize potential for improving efficiency with determination and work perseveringly on making things better, faster, and more efficient.

You are best equipped for this task if you have:

  • A master degree in Mechanical Engineering or equivalent
  • 3+ years previous work experience in the related field
  • Hands on experience in DISCO/Accretech Mechanical Dicing and/or Laser Dicing Machine
  • Experience in APC, SPC, 8D, DMAIC, FMEA
  • Ideally experience in Automated Optical Inspection of diced wafer
  • People mentoring skills and experience
  • Englisch skills with German skills as a plus

This position is subject to the collective agreement for workers and employees in the electrical and electronics industry, employment Group G (www.feei.at/arbeitswelt/kv-tabellen-statistik/mindestloehne-und-gehaelter-2017). The monthly salary is paid 14 times p.a. A higher payment is negotiable depending on your expertise and skills. Furthermore, Infineon offers additional employee benefits.

Part of your life. Part of tomorrow.

We make life easier, safer and greener - with technology that achieves more, consumes less and is accessible to everyone. Microelectronics from Infineon is the key to a better future. Efficient use of energy, environmentally-friendly mobility and security in a connected world - we solve some of the most critical challenges that our society faces while taking a conscientious approach to the use of natural resources.

In the organization of R&D preassembly an interaction between the separation and the corresponding preassembly process (vacuum mounting, mechanical & laser separation) is developed for the highest needs of the customer. Besides classic mechanical abrasive, laser ablation and plasma dicing processes are developed and applied in the production Infineon-wide. With ever increasing demand for quality and efficiency, this area is becoming increasingly important.

Does this sound like just the right challenge for you? If so, we look forward to getting to know you!

Apply online now

Contact

Mag. Sabrina Moser-Schellander
LinkedIn Recruiter Profile

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Infineon Technologies Austria AG

Siemensstraße 2
9500 Villach
Standort

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